UMC’s revenue last year rose 2.3 percent year-on-year to NT$237.55 billion (US$7.58 billion). In addition to AI demand, UMC sees advanced chip packaging and silicon photonics as two new growth engines in the foreseeable future, Wang said. The chipmaker is engaging with 10 customers to supply the advanced chip packaging solutions with more than 20 chips to tape out this year, he said. Revenue from UMC’s advanced packaging technology is expected to become significant next year, attributable to wider adoption of such packaging technology to less advanced chips, Wang said. Regarding silicon photonics, UMC is developing solutions such as photonic integrated circuits and copackaged optics solutions, Wang said.
