Innolux Corp in talks to develop new technologiesBy Lisa Wang / Staff reporterInnolux Corp (群創) said it is in talks with chip companies to jointly develop next-generation panel-level chip packaging technologies, as the company’s first fan-out panel-level packaging (PLP) project entered volume production in the second quarter. Innolux Corp chairman Jim Hung poses for a photograph at a news conference in Taipei yesterday. Photo: CNAThe company estimated that its first fan-out PLP project would generate NT$100 million (US$3.17 million) in revenue. After building its fan-out PLP credentials, Innolux aims to enhance its technological capabilities through cooperation with customers to develop redistribution layer (RDL) technology, a PLP packaging with finer line width, and 3D packaging through glass via (TGV) technology, Hung said. In addition to the new fan-out PLP business, Innolux aims to advance its automobile display unit, CarUX Holding Ltd, to a first-tier vehicle-solution supplier next year.

Source: Taipei Times December 23, 2025 17:13 UTC