OmniVision Integrated Circuits Group’s long‑anticipated second listing in Hong Kong raised roughly HK$4.8 billion, and its shares opened above the offer price before rising further in early trade. The placement yields a market capitalisation at the offer price of about HK$131.7 billion, or nearly $16.9 billion. Proceeds from the Hong Kong offering, converted to U.S. dollars, total roughly $616 million. The mix of strategic and institutional backers underscores broad investor interest in semiconductor names seeking deeper access to international capital via Hong Kong. The listing arrived amid a resurgence of IPO activity in Hong Kong, which has regained traction as a global capital-raising venue.

Source: Economic Times January 12, 2026 09:33 UTC